ENERGY | WIRELESS | NANOTECH | MEMS | OPTICS | QUANTUM | 3D | CHIPS | ALGORITHMS

Monday, June 23, 2014

#CHIPS: "Intel 2nd Gen 3 teraflop Xenon Phi"

With Intel's 3-teraflop next-gen Xeon Phi its market share in supercomputers could soar from 85% to 90% or more, especially with Micron's 3-D memory marvel inside the package for handling Big Data: R. Colin Johnson @NextGanLog


Intel predicts that high-performance computers will grow at a rate of 20% per year as prices drop, inducing more segments to purchase them.


Intel's next-generation Xeon Phi will top 3 teraflops by using the Silvermont architecture, on-package integrated silicon photonics fabric, and 3D hybrid memory cubes jointly developed with Micron.

Further Reading